Lenovo Global Technology ThinkSystem SD550 V3 SPECpower_ssj2008 = 17,466 overall ssj_ops/watt
Test Sponsor: Lenovo Global Technology SPEC License #: 9017 Test Method: Multi Node
Tested By: Lenovo Global Technology Test Location: Beijing, China Test Date: May 17, 2024
Hardware Availability: Apr-2024 Software Availability: Jan-2024 Publication: Jun 18, 2024
System Source: Single Supplier System Designation: Server Power Provisioning: Line-powered
Benchmark Results Summary
Performance Power Performance to Power Ratio
Target Load Actual Load ssj_ops Average Active Power (W)
100% 99.6% 33,511,765 1,660 20,186
90% 90.0% 30,283,754 1,558 19,439
80% 79.8% 26,872,911 1,229 21,858
70% 69.9% 23,540,799 1,102 21,362
60% 60.0% 20,186,756 1,004 20,113
50% 50.0% 16,836,483 900 18,714
40% 40.0% 13,449,650 816 16,478
30% 30.0% 10,097,381 719 14,038
20% 20.0% 6,725,185 620 10,847
10% 10.0% 3,363,642 531 6,340
Active Idle 0 445 0
∑ssj_ops / ∑power = 17,466
Graph of results
Aggregate SUT Data
# of Nodes # of Chips # of Cores # of Threads Total RAM (GB) # of OS Images # of JVM Instances
2 4 256 512 1,024 2 256
System Under Test
Shared Hardware
Shared Hardware
Enclosure: ThinkSystem D3 Chassis
Form Factor: 2U
Power Supply Quantity and Rating (W): 2 x 2700
Power Supply Details: Lenovo P/N:4P57A87629
Network Switch: None
Network Switch Details: None
KVM Switch: None
KVM Switch Details: None
Other Hardware: None
Comment: None
Set: 'sut'
Set Identifier: sut
Set Description: System Under Test
# of Identical Nodes: 2
Comment: 'SUT'
Hardware per Node
Hardware Vendor: Lenovo Global Technology
Model: ThinkSystem SD550 V3
Form Factor: 2U
CPU Name: Intel Xeon Platinum 8592+
CPU Characteristics: 64 Core, 1.9GHz, 320MB L3 Cache
CPU Frequency (MHz): 1900
CPU(s) Enabled: 128 cores, 2 chips, 64 cores/chip
Hardware Threads: 256 (2 / core)
CPU(s) Orderable: 1,2 chips
Primary Cache: 32 KB I + 48 KB D on chip per core
Secondary Cache: 128 MB I+D on chip per chip
Tertiary Cache: 320 MB I+D on chip per chip
Other Cache: None
Memory Amount (GB): 512
# and size of DIMM: 16 x 32768 MB
Memory Details: 32GB 2Rx8 PC5-5600; slots 1 to 16 populated
Power Supply Quantity and Rating (W): None
Power Supply Details: Shared
Disk Drive: 1 x 960GB M.2 SSD P/N:4XB7A82674
Disk Controller: Integrated NVMe controller
# and type of Network Interface Cards (NICs) Installed: 1 x ThinkSystem 1GbE RJ45 4-port
NICs Enabled in Firmware / OS / Connected: 4/4/1
Network Speed (Mbit): 1000
Keyboard: None
Mouse: None
Monitor: None
Optical Drives: No
Other Hardware: None
Software per Node
Power Management: Enabled (see SUT Notes)
Operating System (OS): Microsoft Windows Server 2022 Datacenter
OS Version: Version 21H2 (OS Build 20348.2227)
Filesystem: NTFS
JVM Vendor: Oracle Corporation
JVM Version: Java HotSpot(TM) 64-Bit Server VM (build 17.0.10+11-LTS-240, mixed mode, sharing), version 17.0.10
JVM Command-line Options: -server -Xmn1900m -Xms2048m -Xmx2048m -XX:ParallelGCThreads=2 -XX:+UseLargePages -XX:LargePageSizeInBytes=2m -XX:InlineSmallCode=1500 -XX:UseAVX=1 -XX:AutoBoxCacheMax=20000 -XX:+UseParallelGC -XX:+OptimizeFill -XX:+AggressiveHeap -XX:MaxInlineSize=270 -XX:FreqInlineSize=2500
JVM Affinity: start /NODE[0-3] /AFFINITY [0x3, 0xc, 0x30, 0xc0, 0x300, 0xc00, 0x3000, 0xc000, 0x30000, 0xc0000, 0x300000, 0xc00000, 0x3000000, 0xc000000, 0x30000000, 0xc0000000, 0x300000000, 0xc00000000, 0x3000000000, 0xc000000000, 0x30000000000, 0xc0000000000, 0x300000000000, 0xc00000000000, 0x3000000000000, 0xc000000000000, 0x30000000000000, 0xc0000000000000, 0x300000000000000, 0xc00000000000000, 0x3000000000000000, 0xc000000000000000]
JVM Instances: 128
JVM Initial Heap (MB): 2048
JVM Maximum Heap (MB): 2048
JVM Address Bits: 64
Boot Firmware Version: FNE114H
Management Firmware Version: USX336I
Workload Version: SSJ 1.2.10
Director Location: Controller
Other Software: KB5034129
Boot Firmware Settings
Management Firmware Settings
None
System Under Test Notes
Controller System
Hardware
Hardware Vendor: Lenovo Global Technology
Model: ThinkSystem SR650
CPU Description: 2 x Intel Xeon Gold 5218
Memory amount (GB): 768
Software
Operating System (OS): Microsoft Windows Server 2019 DataCenter - Version 1809 (OS Build 17763.2268)
JVM Vendor: Oracle Corporation
JVM Version: Oracle Java HotSpot(TM) 64-Bit Server VM (build 24.80-b11, mixed mode), version 1.7.0_80
CCS Version: 1.2.6
Measurement Devices
Power Analyzer pwr1
Hardware Vendor: YOKOGAWA, Inc.
Model: WT310E
Serial Number: C3UG05014E
Connectivity: USB
Input Connection: Default
Metrology Institute: China National Accreditation Service for Conformity Assessment (CNAS)
Accredited by: GRG METROLOGY & TEST (BEIJING) CO.,LTD.
Calibration Label: J202308266858A-0005
Date of Calibration: 16-Oct-2023
PTDaemon Host System: same as CCS
PTDaemon Host OS: same as CCS
PTDaemon Version: 1.11.0-a4047d62-20231205
Setup Description: Connected to PSU 1 and PSU 2
Temperature Sensor temp1
Hardware Vendor: Digi International, Inc.
Model: Watchport/H
Driver Version: 5.70.105.0
Connectivity: USB
PTDaemon Host System: same as CCS
PTDaemon Host OS: same as CCS
Setup Description: 50 mm in front of SUT main intake
Notes
Aggregate Electrical and Environmental Data
Target Load Average Active Power (W) Minimum Ambient Temperature (°C)
100% 1,660 22.9
90% 1,558 22.6
80% 1,229 22.6
70% 1,102 22.7
60% 1,004 22.9
50% 900 22.9
40% 816 22.9
30% 719 23.1
20% 620 23.1
10% 531 23.2
Active Idle 445 23.2
Line Standard Minimum Temperature (°C) Elevation (m)
220V / 50 Hz / 1 phase / 2 wires 22.6 43
See the Power/Temperature Details Report for additional details.
Aggregate Performance Data
Target Load Actual Load ssj_ops
Target Actual
Calibration 1     33,780,707
Calibration 2     33,652,181
Calibration 3     33,658,953
ssj_ops@calibrated=33,655,567
100% 99.6% 33,655,567 33,511,765
90% 90.0% 30,290,010 30,283,754
80% 79.8% 26,924,453 26,872,911
70% 69.9% 23,558,897 23,540,799
60% 60.0% 20,193,340 20,186,756
50% 50.0% 16,827,783 16,836,483
40% 40.0% 13,462,227 13,449,650
30% 30.0% 10,096,670 10,097,381
20% 20.0% 6,731,113 6,725,185
10% 10.0% 3,365,557 3,363,642
Active Idle   0 0
Graph of results
See the Aggregate Performance Report for additional details.